Semiconductor Related Products
Transcript Lead-Frame of Electro-Fine Forming Method
Using an ultra-precision technology called, "Electro Fine Forming" we manufacture leadless, surface-mounted, plastic-sealed semiconductor devices offering the added bonus of ultra low height and excellent heat dissipation. Unlike ordinary leadless semiconductor devices with glass epoxy substrates, our devices donユt need through hole so we can cut production costs. This method also requires little initial investment since it uses the current production facility and its equipment.
